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Daniel VonaDaniel Vona 
Besdies the Posted PTN3460 Datasheet and the UM10492, are there any more expanded specs or user's manuals for this product?

 
Best Answer chosen by Daniel Vona
NikkieNikkie (NXP Semiconductors) 
Please check this:
http://www.evernote.com/l/AWVe3kojLkNCBrczdyFeFkuFFAv4Id90uGs/
CuongCuong (NXP Semiconductors Singapore Pte Ltd)  
Can you please provide me a link?
Best Answer chosen by Cuong (NXP Semiconductors Singapore Pte Ltd) 
CuongCuong (NXP Semiconductors Singapore Pte Ltd) 
this is the link for LPC1100 portfolio ... http://www.nxp.com/products/microcontrollers/cortex_m0_m0/lpc1100/
Zang JasinZang Jasin 
Where could i download or consult the datasheet of the product:TDF8544TH.Wait for your answer.
Email:rd8@eltecchina.cn
Thanks
Best Answer chosen by Zang Jasin
CephasCephas (NXP Semiconductors) 
Please submit your details via our notification system on the product information page at "http://www.nxp.com/products/automotive/audio_amplifiers/class_ab_car_radio/TDF8544TH.html#showall" We will notify you when the datasheet is available. 
Conor OConor O 
In all the level shifting datasheets for LVC8T245, LVC1T45 etc, the datasheets talk about suspend mode: "when either VCC(A) or VCC(B) are at GND level, both A port and B port are in the high-impedance OFF-state". The TI datasheets are similar.

So let's say DIR is tied to GND (so B->A), Vcc(A) is at 3V3, and Vcc(B) along with the B inputs are all disconnected (they could form part of an input cable connector). Thus all the B inputs are floating. In this case all the ports should be high impedence and there should be no issues with floating. Is this correct?

I ask because the TI versions of this chip's datasheet say the inputs are always active and can't be allowed to float. Which is why I'm using the NXP versions!
 
Best Answer chosen by Conor O
NikkieNikkie (NXP Semiconductors) 
Once Vcc(B) is at ground level, all ports will be high impedence, no issue with floating
Aaron FreisAaron Freis 
The datasheet for the NVT2006BS shows a thermal pad beneath the component, but does not say whether this should be tied to ground. I assume it should, but can someone confirm?
Best Answer chosen by Aaron Freis
NikkieNikkie (NXP Semiconductors) 
You may tied it to ground for better thermal relief. 
Best Answer chosen by Toshie Nagai
NikkieNikkie (NXP Semiconductors) 
FIT=3.29, MTBF=3.04E8